Die attach film (DAF) is a replacement for the epoxy die attach. Non-conductive die attach film is widely used in the IC manufacturing of semiconductor. The conductive die attach film or also known as (cDAF) takes kick-off for few years with slow start.
No fillet or bleed, allowing for smaller die pad size
Ability to inetgrate more die per package due to tight clearance between the die and die pad (MC)
No fillet or kerf creep, facilitating thinner die handling
Unifrom and consistently thinner bondlines
Cost savings due to less Au wire, lead frame and EMC used
precut format in wide die size range
