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Job Description
Reporting to Director, Assembly Engineering
Knowledge of various equipment mold technology: Leaded, Leadless, In-line.
Responsible as Mold UG leader (Chair) for Molding across A&T sites.
Liaise with factory engineering teams and ensure cross-site coordination.
Drive quality, cost and productivity improvement initiatives, may work in partnership with other functional groups i.e. IE /QA /Package Innovation Global Procurement etc
Able review detailed product requirements & generate equipment technical specifications.
Knowledge in materials properties on molding compound.
Manage and aligned the Equipment Life Cycle Management (LCM) with Package Roadmap.
Supervise equipment benchmarking at backend sites.
Work with key Equipment OEM headquarters for total NXP support.
Other responsibilities may be assigned over time as needed and applicable.
Job Experience
Process or Equipment engineer with 10 years’ experience or more.
Equipment automation /integration related experience will be added advantage.
Project management experience will be an advantage.
Previous direct project work with suppliers on quality or productivity improvement projects.
Strong Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems.
Cross cultural work experience
Education
Bachelor’s Degree in Engineering or Science in technical discipline.
6 sigma green belt or above certified recommended.
Working Style
Good communication skills, knowledge in multi-languages will be an advantage.
Self-motivated working style & able to work independent, delivery of KPI’s expected.
Possess good collaboration skills & ability to promote strong teamwork across multi-cultural teams.
Ability to travel as need arises to support cross site projects
Job Description
Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module Engineering) supporting New Product Introduction/Qualification from Development to High volume manufacturing.
Essential Duties And Responsibilities
New Die Prep (Wafer Backgrinding, Sawing, Laser Dicing, Stealth Laser Dicing) Process Development for new wafer technology, next generation products, new material qualifications, new machine qualifications and new process qualifications.
Setup new recipe for Die Prep processes (Back-grinding, mounting, laser groove, mechanical dicing, tape & reel), perform complete window study, DOEs, corner limits.
Golden recipe setup for new package qualification.
Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
Process transfer from Development to New product Introduction team & from site to site.
Work closely with Cross site’s Product development & design team to understand the Package Design Rules & Requirements.
Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
Qualifications
REQUIRED:
Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, & etc).
Min 2 years of working experience in Semiconductor Process development.
Process engineering/ NPI engineering background.
Knowledge in Semiconductor assembly processes.
Preferred
Min 4 years of working experience in Semiconductor Process development.
Process engineering/ NPI engineering background with either one of the processes below: wafer. thinning/ backgrinding, Mechanical dicing, laser dicing/ laser grooving, wafer inspection/ Automatic optical inspection, stealth dicing.
Innovative, have patent disclosure will be an added advantage.
Knowledge in Artificial Intelligent and machine learning, an added advantage.
Experience in Process transfer from Development to New product Introduction team & from site to site.
Skills
Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
Knowledge of Design Of Experiment (DOE).
Familiarize with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP.
Good project planning, strong sense of quality and urgency.
Team leads with good communication and interpersonal skills.
JOB DESCRIPTION
This job requires a full-time senior engineer with strong engineering knowledge and skills in mold and trim and form equipment and process for early engagement in package development and qualification for a robust HVM.
Knowledge, Skills And Abilities
Must be statistically sound and familiar in running DOE, perform characterization and optimization studies independently. Familiar with JMP/ minitab software is an advantage.
Qualifications
QUALIFICATION AND EXPERIENCE
Minimum Bachelor’s Degree in Electronic, Electrical, Mechanical, material Engineering or equivalent.
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you’ll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following responsibilities:
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
Put your talent to work with us as a Packaging engineer!
Qualifications
Minimum Requirements:
Preferred Qualifications
Job Description
The Test Engineer will be responsible for manufacturing process quality control & product transfer management for Final Test operations at external subcontractor for ON Semiconductor.
Key responsibilities include, but not limited to, the following
Lead projects to improve Test process quality control, productivity & best practice implementation.
Works with manufacturing, QA/QE, BU product & operation engineering teams to resolve customer quality issues.
Coordinate test transfer projects involving product, equipment, test program, system and processes. Formulate project plan and execute per schedule.
Work with subcon and Test Development team on test hardware/software requirements, and take lead in resolving problem arises from products’ testing.
Participate in Manufacturing Effectiveness or VDA audit (MEA/VDA) & conduct regular test escape audit at subcon sites.
Qualifications
The candidate must have an undergraduate degree in engineering and comes from the semiconductor industry. Backgrounds in test operation engineering in a high volume manufacturing environment.
The successful candidate must have at minimum the following
Test Engineering with minimum 5 years’ working experience
Knowledge on manufacturing process and equipment capabilities
Knowledge on ATE tester (ETS/TMT/Maverick/Tesec) & handler platform (mappers, gravity feed, bowl feed, pick and place) and programming software.
Strong project management skills
Able to lead, execute plans effectively and direct subcons to improve product quality / yield / productivity to achieve organizational goals.
Able to gather, organize and analyze information/data through statistical methods.
Ability to work independently with good communication and interpersonal skill.
Willing and able to travel as much as the job requires, typically within Asia region
Prolong working period away from home in the event of job related crisis.
Job Summary
To provide engineering support and solution in driving project execution and completion within specified timeframe. Ensure smooth project transition that meet Quality, Cost & Delivery requirement of ON Semiconductor.
Job Description
Capable to digest Project scope, objective and key deliverables. Analyze Project details and propose a comprehensive schedule
Conduct comprehensive evaluation and qualification in accordance to ON Semiconductor Quality requirement.
Dive into details, issues and support in providing engineering solution. Ensure smooth Project hand over.
Work closely with Suppliers and determine optimum process condition through inclusive validation activity.
Conduct deep analysis in problem solving by utilizing tools such as JMP.
Prepare all necessary analysis report and present for board approvals.
Perform all other related duties as and when assigned by the Superior/HODs.
Job Requirement
Bachelor’s Degree in Material, Science and Engineering or related field from recognized Higher Institution
At least 5 – 8 years experiences in related fields preferably in manufacturing semiconductor and familiar working with high-growth, fast-paced and changing work environment. Experience in supervisory roles would be an added advantage.
Strong technical and manufacturing knowledge especially in Semiconductor Assembly.
Strong skills in Assembly Process such as Wire Bond, Cu Wire, Materials and Cu Clips will be advantage.
Good knowledge & skill in JMP tools
Must possess product knowledge such as QFN, QFP, SOIC, fcBGA.
Job Highlights
Specially looking for talented candidates
Employer of choice
Join a high performing team
Job Description
A core technical team member in R&D by providing Finite Element Analysis modelling & simulation to new design concepts.
Identify & prevent design issues or risk in the early stage of development.
Act as a problem solver by finding physics-based explanations to customers’ problems and suggesting appropriate solutions.
Recommend and suggest design / process improvements to enhance the package/process robustness.
Provide technical guidance & coaching to junior engineers through knowledge sharing.
Drive continuous development of leading edge simulation approaches & advanced material modelling to enhance simulation accuracy and efficiency; ability to identify and leverage on the resources and expertise of research institutions/universities for such studies / projects if appropriate.
Job Requirements
Ph.D/Master’s/Bachelor’s Degree in Physics, Mechanical Engineering, Computational Mechanics, or Materials with relevant industrial experience.
Highly proficient in applied mechanics with emphasis on both analytical and computational methods.
Hands-on experience in Finite Element Analysis tools (ANSYS, COMSOL, etc.) & CAD tools.
Experience in material characterization methodology, analysis & modelling.
Strong analytical thinking with excellent communication skills.
Deep understanding in packaging technologies, assembly processes, semiconductor packaging materials, reliability standards, FA techniques will be an added advantage.
Experience in Electromagnetic simulation will be an added advantage.
PhD fresh graduates with research in modeling & simulation are encouraged to apply
The Successful Candidate Will Have The Opportunity To:
Be the Technical Lead and contact window for NPD/ site transfer (out-sourcing and in-sourcing) in the external manufacturing organization
Lead cross functional team (comprising both internal and external stakeholders) for NPD/ site transfer projects through product/ process/ manufacturing gap analysis, risk assessment and mitigation to achieve process robustness, 1st pass qualification and flawless production ramp
Establish technical excellence, Best Known Methods (BKM) and Best-in-Class practices through collaboration with sending/ receiving site for assembly performance benchmarking, process control, yield improvement and fan-out lesson learnt
Prepare and manage assembly sites manufacturing readiness to ensure smooth production release, including safe-launch activities. Support on-site troubleshooting and resolution of process issues
Participate in quality and process readiness audit at receiving sites to achieve manufacturing readiness prior to production release
Co-work with operations to drive continuous yield improvement
Job Qualifications:
Bachelor’s Degree in Engineering or equivalent technical background
More than 8 years of experience in backend semiconductor IC manufacturing environment, with in-depth engineering expertise and shop floor experience in one or more key processes such as Die Attach, Wire-bonding or Transfer Molding
Hands on experience in driving assembly device startup/ technology transfer from conceptualization, characterization, qualification to HVM
Experience in Cu wire bonding/ PQFN process development/ package design will be highly advantageous
Track record of leading cross-functional team, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem solving skills
Strong project management skills and multi-stakeholder management
Good overall understanding of backend assembly turnkey services
Process & Equipment Engineers
Job Description
(Semiconductor / Opto-Electronic devices assembly)
To provide Process & Equipment Engineering support for the existing and in new Products process development.
At least 5 years hands on experience in process set up, optimization and maintenance of critical assembly equipments like Automatic die attach machines, wire bonders, epoxy dispensers etc
Diploma / Bachelor’s degree in Mechanical / Electrical / Electronics Engineering or equivalent
Senior/Engineer – Process Development
Engineering
Process Development
Degree in Engineering disciplines (electrical, mechanical, mechatronics, material science or related discipline)
Be key driver to ensure improvement, qualification and implementation of new processes/products including changes and/or new product introduction, are in-line with the overall production performance enhancement targets
Be the key driver to ensure that REC Modules deliver world class leading top quality product through well controlled process and manufacturing flow, from material supplies to product deliveries
Candidates must be willing to relocate to Singapore
Min 2-3 years relevant SOLAR experience required
Comprehensive welfare/benefits and training will be provided.
Product Development & Design Engineer / Manager
Responsibilities & Work Scope:
Responsible to maintain, revise design and upgrade the bill-of-material, specifications of raw material, components and costing for product lines including chillers, package air-conditioners, air-handling units and fancoils, etc
To develop / design new products and preparation of catalogues and manuals
Qualification & Experience:
Minimum Bachelor of Engineering degree in either mechanical, electrical or electronics engineering. Graduates from reputable universities in USA, UK and Australia are preferred, in particular, those with Masters or PhD degrees
Must be fluent in written and spoken English
Attractive remuneration and benefits for successful candidates with good academic results from internationally recognized and reputable universities
Salary range between RM 3,500.00 to RM10,000.00 per month
STAFF Engineer, Manufacturing Engineering
Essential Duties And Responsibilities
SPI and AOI Inspection Programmer.
Automated engineering data reporting, dashboard and auto triggering.
Program scripting for engineering data analysis and process auto triggering
Required Qualifications
Engineering Degree in Engineering of Chemistry / Physics / Mechanical / Electro-Mechanical /Electrical Engineering or equivalents number of years of hands on experience and technological know how.
Minimum 3 years experience in an electronics/PCBA manufacturing environment and must be technically sound and confident as well as well-versed with latest Assembly technology developmen
The primary role of the SMT Programmer is to program Fuji NXT pick and place machines and Koh Young Automated Optical Inspection machine.
Responsible for identifying and understanding operator/machine reporting messages.
Accountable for the daily machine operation when necessary.
Responsible for Koh Young SPI Inspection machine operation when needed.
Responsible for being part of the SMT improvement project when required.
Preferred
A proven desire to work as a team member, both on the same team and outside of the team.
Experienced in all SMT related Equipment processes such as Solder Paste Printing / Pick & Place / Reflow / AOI / API / Router/ Cleaning equipment and final product packaging
Good command in English and Bahasa Malaysia
Possesses excellent knowledge in SMT PCBA Assembly Process technology
Skills
Sense of right responses by being aware of urgency, demands
Make available – as priorities may change rapidly and provide right actions with right timings
A good degree of recognizing what need to be done BEFORE being asked what to do
Able to adapt to change of plans at last minute
Able to remain calm and clear-headed when dealing with complex situations, including managing diverse demands
Good analytical skills required when dealing with diverse complex situations, with accurate assessment of anticipated consequences
Ability to multitask effectively in time critical environment
CTO Process & Equipment Engineer
As an CTO Process & Equipment Engineer, you will be responsible for evaluating and improving manufacturing processes and equipment, coordinate equipment procurement and qualify and implement new process and equipment. You will be working closely with cross-functional team, including manufacturing, test, IT and suppliers to maintain or improve the process and equipment.
Responsibilities and Tasks
Evaluate and Improve Manufacturing Processes and Equipment
Maintain General process knowledge
Maintain Equipment knowledge as it relates to the process
Optimize process and/or equipment variables
Identify all process variables
Understand DOE/FMEA/SPC techniques
Perform containment of process and equipment deviations
Determine root cause
Implement corrective action
Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment).
Maintain knowledge of equipment and materials and how they interact
Design new fixture for new product or improvement on quality
Evaluate Future Process and Equipment
Collaborate with supplier on the design of new equipment
Evaluate pertinent technology and engineering advancements relating to equipment and processes
Build and maintain effective relationships with suppliers
Evaluate new tooling material for cost saving effort
Coordinate Training Requirements and Conduct Training
Develop, or coordinate development of, training materials for existing equipment
Coordinate and conduct technical training with Engineering and Equipment Support (EES) group
Conduct training for production trainers
Train and mentor others
Requirements
Minimum of a Bachelor’s degree in Engineering. Mechanical/Mechatronics Engineering is preferred
Experience in or knowledge on semiconductor manufacturing process and technologies
Knowledge on SCARA & 6-Axis robot, PLC and basic electronics systems
Familiar with root cause analysis techniques, FMEA, QC tools, KTDA
Experience in 3D CAD software
Knowledge on Windows, network, database & pc hardware is preferred
Experience in equipment maintenance and troubleshooting is preferred
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Description
The Associate Principal Mechatronics Engineer will work with our world-class product designers, electronics engineers and software specialists to design and develop mechatronic systems for our R&D projects. The role of the Associate Principal Mechatronics Engineer will be top secret, interesting and varied but he/she will typically split their time between the specification, design, and implementation of automated test equipment and developing mechatronic solutions for consumer products. In either case they’ll be responsible for specifying, developing, testing, analysing and improving the important electro-mechanical systems that facilitate our new consumer products. The engineer will sit within our Mechatronics Engineering team and be an influential part of a highly creative and dynamic R&D department.
Accountabilities
Specify, develop, test, analyse and improve new mechatronic systems in our R&D projects
Use a blend of electronics, mechanical and control system expertise to problem solve and offer solutions to technical challenges on a day to day basis
Designing new prototypes and test platforms
Use common signal acquisition, data analysis and simulation techniques to measure a design’s performance
Communicate progress and technical information in regular cross-function meetings
Mentor engineers and specialists from a wide variety of technical disciplines
Skills
A smart, intelligent individual
A strong bachelor/masters degree/PhD in mechatronics, control systems, mechanical, electronics, or related engineering field – CGPA equal to or greater than 3.5.
Experience of mechatronics, control system design and/or automation engineering
Working or academic experience of using electronics, software and electro-mechanical sensors and actuators
Demonstrated project or work experience in at least two of the following areas: mechanical design, electrical/electronic design, software development
Coding experience, preferably in Python, LabVIEW, and/or C
Familiarity with CAD packages (particularly Siemens NX) and the LabVIEW programming environment would be beneficial but not essential
Working or academic experience of signal acquisition/analysis techniques
Able to specify experimental programmes and effectively analyse results, summarise findings and make recommendations
Experience leading a team of engineers in the development of their technical skills and careers. Willingness/ability to mentor others
Excellent analytical and problem solving ability
Excellent English language communication and presentation skills. Proven ability to translate and communicate technical information to project teams, managers and directors when required
Ability to work effectively both individually and in a team environment
Excellent organisational skills. Able to plan ahead, prioritise tasks and co-ordinate with the work of others
Proactive and highly motivated individual – keen to make a difference to Dyson’s innovative products
Associate Principal Mechatronics Engineer
Description
The Associate Principal Mechatronics Engineer will work with our world-class product designers, electronics engineers and software specialists to design and develop mechatronic systems for our R&D projects. The role of the Associate Principal Mechatronics Engineer will be top secret, interesting and varied but he/she will typically split their time between the specification, design, and implementation of automated test equipment and developing mechatronic solutions for consumer products. In either case they’ll be responsible for specifying, developing, testing, analysing and improving the important electro-mechanical systems that facilitate our new consumer products. The engineer will sit within our Mechatronics Engineering team and be an influential part of a highly creative and dynamic R&D department.
Accountabilities
Specify, develop, test, analyse and improve new mechatronic systems in our R&D projects
Use a blend of electronics, mechanical and control system expertise to problem solve and offer solutions to technical challenges on a day to day basis
Designing new prototypes and test platforms
Use common signal acquisition, data analysis and simulation techniques to measure a design’s performance
Communicate progress and technical information in regular cross-function meetings
Mentor engineers and specialists from a wide variety of technical disciplines
Skills
A smart, intelligent individual
A strong bachelor/masters degree/PhD in mechatronics, control systems, mechanical, electronics, or related engineering field – CGPA equal to or greater than 3.5.
Experience of mechatronics, control system design and/or automation engineering
Working or academic experience of using electronics, software and electro-mechanical sensors and actuators
Demonstrated project or work experience in at least two of the following areas: mechanical design, electrical/electronic design, software development
Coding experience, preferably in Python, LabVIEW, and/or C
Familiarity with CAD packages (particularly Siemens NX) and the LabVIEW programming environment would be beneficial but not essential
Working or academic experience of signal acquisition/analysis techniques
Able to specify experimental programmes and effectively analyse results, summarise findings and make recommendations
Experience leading a team of engineers in the development of their technical skills and careers. Willingness/ability to mentor others
Excellent analytical and problem solving ability
Excellent English language communication and presentation skills. Proven ability to translate and communicate technical information to project teams, managers and directors when required
Ability to work effectively both individually and in a team environment
Excellent organisational skills. Able to plan ahead, prioritise tasks and co-ordinate with the work of others
Proactive and highly motivated individual – keen to make a difference to Dyson’s innovative products
